7WBD3305USG(2014) Ver la hoja de datos (PDF) - ON Semiconductor
Número de pieza
componentes Descripción
Fabricante
7WBD3305USG Datasheet PDF : 12 Pages
| |||
7WBD3305
PACKAGE DIMENSIONS
−X−
A
8
5
−Y−
B
L
US8
CASE 493
ISSUE B
J
DETAIL E
1
4
P
G
R
S
U
C
−T−
K
SEATING D
PLANE
0.10 (0.004) T
H
N
0.10 (0.004) M T X Y
V
F
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
R 0.10 TYP
M
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 1.90 2.10 0.075 0.083
B 2.20 2.40 0.087 0.094
C 0.60 0.90 0.024 0.035
D 0.17 0.25 0.007 0.010
F 0.20 0.35 0.008 0.014
G
0.50 BSC
0.020 BSC
H
0.40 REF
0.016 REF
J 0.10 0.18 0.004 0.007
K 0.00 0.10 0.000 0.004
L 3.00 3.20 0.118 0.126
M
0_ 6_ 0_ 6_
N
5 _ 10 _ 5 _ 10 _
P 0.23 0.34 0.010 0.013
R 0.23 0.33 0.009 0.013
S 0.37 0.47 0.015 0.019
U 0.60 0.80 0.024 0.031
V
0.12 BSC
0.005 BSC
0.50
0.0197
SOLDERING FOOTPRINT*
3.8
0.15
1.8
0.07
0.30
0.012
1.0
0.0394
ǒ Ǔ SCALE 8:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
Share Link: 