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VNQ830M(2003) Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza
componentes Descripción
Fabricante
VNQ830M
(Rev.:2003)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
VNQ830M Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
VNQ830M
SO-28 DOUBLE ISLAND THERMAL DATA
SO-28 Double island PC Board
CLauytohuictkcnoensdsit=io3n5µomf R, tChoapnpdeZr tahremaesa:s0u.5recmme2n, t3sc(mP2C, B6cFmR24).area= 58mm x 58mm, PCB thickness=2mm,
Thermal calculation according to the PCB heatsink area
Chip 1
ON
OFF
ON
ON
Chip 2
OFF
ON
ON
ON
Tjchip1
RthA x Pdchip1 + Tamb
RthC x Pdchip2 + Tamb
RthB x (Pdchip1 + Pdchip2) + Tamb
(RthA x Pdchip1) + RthC x Pdchip2 + Tamb
Tjchip2
Note
RthC x Pdchip1 + Tamb
RthA x Pdchip2 + Tamb
RthB x (Pdchip1 + Pdchip2) + Tamb
Pdchip1=Pdchip2
(RthA x Pdchip2) + RthC x Pdchip1 + Tamb Pdchip1Pdchip2
RthA = Thermal resistance Junction to Ambient with one chip ON
RthB = Thermal resistance Junction to Ambient with both chips ON and Pdchip1=Pdchip2
RthC = Mutual thermal resistance
Rthj-amb Vs. PCB copper area in open box free air condition
RTHj_am b
(°C/W)
70
60
50
RthA
40
30
RthB
20
10
0
RthC
1
2
3
4
5
6
7
PCB Cu heatsink area (cm ^2)/island
16/20

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