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TMC1103 Ver la hoja de datos (PDF) - Fairchild Semiconductor

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TMC1103 Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
PRODUCT SPECIFICATION
Mechanical Dimensions – 80-Lead MQFP Package
TMC1103
Symbol
A
A1
A2
B
C
D
D1
E
E1
e
L
N
ND
NE
a
ccc
Inches
Min. Max.
.134
.010
.100 .120
.012 .018
.005 .009
.904 .923
.783 .791
.667 .687
.547 .555
.0315 BSC
.025 .041
80
24
16
0¡
7¡
.004
Millimeters
Min. Max.
3.40
.25
2.55 3.05
.30
.45
.13
.23
22.95 23.45
19.90 20.10
16.95 17.45
13.90 14.10
.80 BSC
.65
1.03
80
24
16
0¡
7¡
0.10
Notes
3, 5
5
4
Notes:
1. All dimensions and tolerances conform to ANSI Y14.5M-1982.
2. Controlling dimension is millimeters.
3. Dimension "B" does not include dambar protrusion. Allowable
dambar protrusion shall be .08mm (.003in.) maximum in excess of
the "B" dimension. Dambar cannot be located on the lower radius
or the foot.
4. "L" is the length of terminal for soldering to a substrate.
5. "B" & "C" includes lead finish thickness.
E1
E
A A2
A1
D
D1
Pin 1
Identifier
Seating Plane
.20 (.008) Min.
e
Datum Plane
0¡ Min.
.13 (.30)
.005 (.012)
R
C
.13 (.005) R Min.
a
B
L
0.063" Ref (1.60mm)
Lead Detail
See Lead Detail
Base Plane
-C-
LEAD COPLANARITY
ccc C
15

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