PF28F1602C3TD70 Ver la hoja de datos (PDF) - Intel

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PF28F1602C3TD70

Intel® Advanced+ Boot Block Flash Memory (C3)

Intel 

C3 SCSP Flash Memory

Appendix H Ordering Information

.

Table 38.

Ordering Information for Product Combinations with 0.25 µm to 0.13 µm Flash

RD2 8 F 1 6 0 2C3 TD7 0

Table 39.

Package

RD = Leaded Ball Stacked -CSP

PF = Lead-Free Ball Stacked-CSP

Product Line Designator

28F or 38F = Intel® Flash Memory

Flash Density

320 = x16 (32 Mbit)

160 = x16 (16 Mbit)

SRAM Device Density

8 = x16 (8 Mbit)

4 = x16 (4 Mbit)

2 = x16 (2 Mbit)

Access Speed (ns)

16 Mbit = 70, 90, or 110 ns

32 Mbit = 70 or 90 ns

Technology

Differentiator

D = 0.13µm

<blank> = 0.25µm or

0.18µm (refer to access

speed for differientation)

Parameter Location

T = Top Blocking

B = Bottom Blocking

Product Family

C = Advanced+ Boot Block

Flash Memory

Ordering Information for Combinations specific to 32M 0.13 µm Flash

RD3 8 F 1 0 1 0 C0 Z T L 0

Package

RD = Leaded Ball Stacked-CSP

PF = Lead-Free Ball Stacked-CSP

Product Line Designator

38F = Intel® Flash Stacked Memory

Density

Flash #1 = 1 = 32 Mbit

Flash #2 = 0 = No Die

Flash #3 = 1 = 4 Mbit SRAM

=2 = 8 Mbit SRAM

Flash #4 = 0 = No Die

Product Family

C = Advanced+ Boot Block Flash Memory

Device Details

0 = Original Version of

this product:

Flash Speed = 70 ns

Flash Process = 0.13 µm

Vccq = 2.7 V to 3.3 V

Pinout Indicator

L = 72 ball "I"-ballout

Parameter Location

T = Top Blocking

B = Bottom Blocking

Voltage

Z = 3.0 V I/O

26 Aug 2005

74

Intel® Advanced+ Boot Block Flash Memory (C3) SCSP Family

Order Number: 252636, Revision: 004

Datasheet

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