MT47H128M8JN-3H Ver la hoja de datos (PDF) - Micron Technology

Número de pieza

componentes Descripción

Fabricante

MT47H128M8JN-3H

1Gb: x4, x8, x16 DDR2 SDRAM

Micron Technology 

1Gb: x4, x8, x16 DDR2 SDRAM

Packaging

Figure 9: 60-Ball FBGA (8mm x 10mm) – x4, x8 Die Rev :H

0.155

Seating plane

60X Ø0.45

Dimensions

apply to solder

balls post-reflow

on Ø0.35 SMD

ball pads.

10 ±0.1

8 CTR

0.8 TYP

1.8 CTR

Nonconductive

A

overmold

0.12 A

987

321

A

B

C

D

E

F

G

H

J

K

L

Ball A1 ID

Ball A1 ID

0.8 TYP

1.1 ±0.1

6.4 CTR

0.25 MIN

8 ±0.1

Exposed gold plated pad

1.0 MAX X 0.7 nominal.

Notes: 1. All dimensions are in millimeters.

2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,

36%Pb, 2% Ag).

PDF: 09005aef8565148a

1GbDDR2.pdf – Rev. AA 07/14 EN

19

Micron Technology, Inc. reserves the right to change products or specifications without notice.

© 2007 Micron Technology, Inc. All rights reserved.

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