MAX3657(2004) Ver la hoja de datos (PDF) - Maxim Integrated
Número de pieza
componentes Descripción
Fabricante
MAX3657 Datasheet PDF : 15 Pages
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155Mbps Low-Noise Transimpedance
Amplifier
Chip Topographies
Topography for MAX3657
OUT-
1
10
11
OUT+
N.C.
GND
2
GNDZ
3
0.048in
1.219mm
9
VCC
8
VCCZ
4
5
6
7
MON IN FILT
N.C.
0.041in
1.041mm
Topography for MAX3657B
OUT+
1
10
11
OUT-
N.C.
Pin Configuration
TOP VIEW
OUT- N.C. OUT+
12 11 10
N.C. 1
GND 2
GNDZ 3
MAX3657
9 N.C.
8 VCC
7 VCCZ
4
5
6
MON IN FILT
QFN
*EXPOSED PAD IS CONNECTED TO GND.
Chip Information
TRANSISTOR COUNT: 417
PROCESS: Silicon bipolar
SUBSTRATE: Connected to GND
DIE SIZE: 1.04mm x 1.22mm
GND
2
GNDZ
3
0.048in
1.219mm
9
VCC
8
VCCZ
4
5
6
7
MON IN FILT
N.C.
0.041in
1.041mm
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