155Mbps to 2.5Gbps Burst-Mode
Laser Driver
Functional Diagram
VCC
MAX3656
IN+
IN-
BEN+
BEN-
RP
LP
OUT-
IMOD
OUT+
RD
IBIAS
BIAS+
RD
BIAS-
RCOMP
CCOMP
VCC
APC
DAC
DSP
MD
ASP
RMODSET
RBIASMAX
EN FAIL LONGB
RAPCSET
Chip Information
TRANSISTOR COUNT: 8153
PROCESS: SiGe BIPOLAR
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE
TYPE
24 TQFN-EP
PACKAGE
CODE
T2444-3
OUTLINE
LAND
NO. PATTERN NO.
21-0139
90-0021
14 ______________________________________________________________________________________