BSP315 Ver la hoja de datos (PDF) - Infineon Technologies
Número de pieza
componentes Descripción
Fabricante
BSP315 Datasheet PDF : 10 Pages
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Thermal Characteristics
Parameter
Characteristics
Thermal resistance, junction - soldering point
(Pin 4)
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area 1)
BSP315P
Symbol
Values
Unit
min. typ. max.
RthJS
RthJA
-
-
25 K/W
K/W
-
-
115
-
-
70
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
min. typ. max.
Static Characteristics
Drain- source breakdown voltage
VGS = 0 V, ID = -250 µA
Gate threshold voltage, VGS = VDS
ID = -160 µA
Zero gate voltage drain current
VDS = -60 V, VGS = 0 V, Tj = 25 °C
VDS = -60 V, VGS = 0 V, Tj = 125 °C
Gate-source leakage current
VGS = -20 V, VDS = 0 V
Drain-Source on-state resistance
VGS = -4.5 V, ID = -0.89 A
Drain-Source on-state resistance
VGS = -10 V, ID = -1.17 A
V(BR)DSS -60
-
-
VGS(th)
-1
-1.5
-2
IDSS
IGSS
- -0.1 -1
-
-10 -100
-
-10 -100
RDS(on)
-
0.8 1.4
RDS(on)
-
0.5 0.8
Unit
V
µA
nA
Ω
Ω
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Rev.1.7
Page 2
2012-11-26
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