1ED020I12-F Ver la hoja de datos (PDF) - Infineon Technologies

Número de pieza

componentes Descripción

Fabricante

1ED020I12-F

Single IGBT Driver IC

Infineon Technologies 

EICEDRIVERTM

1ED020I12-F

Application Notes

8

Application Notes

8.1

Reference Layout for Thermal Data

The PCB layout shown in figure 12 represents the reference layout used for the thermal characterisation. Pins 9 and 16

(GND1) and pins 1 and 8 (VEE2) require ground plane connections for achiving maximum power dissipation. The

1ED020I12-F is conceived to dissipate most of the heat generated through this pins.

Output Side

Input Side

PCB + Top-Layer

Total Area = 374.4 mm2

PCB + Bottom-Layer

Figure 10: Reference layout for thermal data (Copper thickness 105µm)

8.2

Printed Circuit Board Guidelines

Following factors should be taken into account for an optimum PCB layout.

- Sufficient spacing should be kept between high voltage isolated side and low voltage side circuits.

- The same minimum distance between two adjacent high-side isolated parts of the PCB should be maintained to increase the

effective isolation and reduce parasitic coupling.

- In order to ensure low supply ripple and clean switching signals, bypass capacitor trace lengths should be kept as short as

possible.

Datasheet

20

Version 2.2, 2009-12-03

Share Link: