UPC1093G Ver la hoja de datos (PDF) - Renesas Electronics

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Fabricante

UPC1093G

ADJUSTABLE PRECISION SHUNT REGULATORS

Renesas Electronics 

µPC1093

RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering

processes are used, or if the soldering is performed under different conditions, please make sure to consult with our

sales offices.

For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(C10535E).

Through-hole device

µPC1093J: 3-pin plastic SIP (TO-92)

Process

Wave soldering

(only to leads)

Solder temperature: 260 °C or below,

Flow time: 10 seconds or less.

Conditions

Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure

that the package body does not get jet soldered.

Surface mount devices

µPC1093G: 8-pin plastic SOP (225 mil)

Process

Infrared ray reflow

VPS

Wave soldering

Conditions

Peak temperature: 230 °C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210 °C or higher),

Maximum number of reflow processes: 1 time.

Peak temperature: 215 °C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200 °C or higher),

Maximum number of reflow processes: 1 time.

Solder temperature: 260 °C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120 °C or below (Package surface temperature).

Symbol

IR30-00-1

VP15-00-1

WS60-00-1

Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.

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