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73K222BL-IGT Ver la hoja de datos (PDF) - TDK Corporation

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73K222BL-IGT Datasheet PDF : 26 Pages
First Prev 21 22 23 24 25 26
73K222BL
V.22, V.21, Bell 212A, Bell 103
Single-Chip Modem with Integrated Hybrid
PACKAGE PIN DESIGNATIONS
(Top View)
CAUTION: Use handling procedures necessary for
a static sensitive component.
AD0
AD1
AD2
AD3
AD4
AD5
AD6
DATA/AD7
ALE
4 3 2 1 32 31 30
5
29
6
28
7
27
8
26
9
25
10
24
11
23
12
22
13
21
14 15 16 17 18 19 20
N/C
ISET
OH
RXCLK
RXD
TXD
CS
EXCLK
TXCLK
32-Lead PLCC
73K222BL-IH
44-Lead TQFP
73K222BL-IGT
ORDERING INFORMATION
PART DESCRIPTION
73K222BL
32-Lead PLCC
73K222BL
44-Lead TQFP
ORDER NUMBER
73K222BL-IH
73K222BL-IGT
PACKAGING MARK
73K222BL-IH
73K222BL-IGT
No responsibility is assumed by TDK Semiconductor Corporation for use of this product nor for any infringements of patents and trademarks
or other rights of third parties resulting from its use. No license is granted under any patents, patent rights or trademarks of TDK
Semiconductor Corporation and the company reserves the right to make changes in specifications at any time without notice. Accordingly, the
reader is cautioned to verify that the data sheet is current before placing orders.
TDK Semiconductor Corporation, 2642 Michelle Drive, Tustin, CA 92780-7019, (714) 508-8800, FAX: (714) 508-8877
TDK Semiconductor Corporation
04/24/00- rev. E
26

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