CXA2556Q Ver la hoja de datos (PDF) - Sony Semiconductor
Número de pieza
componentes Descripción
Fabricante
CXA2556Q Datasheet PDF : 22 Pages
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Package Outline
Unit: mm
CXA2556Q
32PIN QFP (PLASTIC)
24
25
9.0 ± 0.2
+ 0.3
7.0 – 0.1
17
16
0.1
+ 0.35
1.5 – 0.15
32
9
1
8
+ 0.15
0.8
0.3 – 0.1
± 0.12 M
+ 0.2
0.1 – 0.1
+ 0.1
0.127 – 0.05
0° to 10°
SONY CODE
EIAJ CODE
JEDEC CODE
QFP-32P-L01
∗QFP032-P-0707-A
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
42 ALLOY
0.2g
– 22 –
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