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MXED202 Ver la hoja de datos (PDF) - Clare Inc => IXYS

Número de pieza
componentes Descripción
Fabricante
MXED202
Clare
Clare Inc => IXYS Clare
MXED202 Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
MXED202
Preliminary
BONDING PADS
Locations and Sizes -Driver Outputs
The information contained on this page is preliminary. Although the order of the bond pad will remain the same, the XY dimensions in the final
document may vary slightly. Please take this possibility into consideration when doing any chip on board layouts.
14
www.clare.com
Rev. 2

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