RF3321 Ver la hoja de datos (PDF) - RF Micro Devices
Número de pieza
componentes Descripción
Fabricante
RF3321 Datasheet PDF : 16 Pages
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Preliminary
RF3321
Evaluation Board Schematic
(Download Bill of Materials from www.rfmd.com.)
R7
R8
Q1
VCC
J1
1 NC
CS 2 CS
SDA 3 SDA
SCLK 4 SCLK
J5-1 5 SHDNB
J3-1 6 TXEN
7 NC
R1
100 kΩ
8 NC
9 NC
10 VCC
J3
J2
1
J1-6
TXEN
1
VCC
2
2
3
3 GND
J5
J4
1
J1-5
SHDNB
1
VCC
2
2
VCC2
L4 (Ferrite)
30 Ω
VCC
VCC1
L2 (Ferrite)
30 Ω
L3 (Ferrite)
30 Ω
L5 (Ferrite)
30 Ω
C11
1 nF
+ C10
10 µF
(10 V)
L1 (Ferrite)
30 Ω
C2
1 nF
+ C1
10 µF
(10 V)
JP1
1 VCC 9V
2 VCC2
3
3 VCC1
4 GND
11 NC
3
3 GND
12
13 NC
1
16
R2
100 kΩ
14 NC
15 VCC
16 NC
17 NC
18 GND
19 GND
20 GND
21 GND
22 GND
23 GND
24 GND
25 GND
J6
RF IN
VCC1
2
R5
75 Ω
C3
3
T1
1 nF
1:1
3
4
4
2
5
1
6
5
R4
C4
75 Ω 1 nF
6
7
C5
0.1 µF
8
C6
220 pF
Power
Control
15
14
13
12
11
Gain Control
and Serial Bus
10
9
PACKAGE BASE
C7
15 pF
VCC
T2
4:1
3
4
2
5
1
6
R6
24 Ω
C8
15 pF
C9
100 pF
VCC2
J7
RF OUT
SDA
CS
Notes:
1. 4-layer board.
3321400C
2. Underside of package must solder to ground.
3. Place C5 and C6 as close to pin as possible.
4. C1 and C10 are tantalum, size code Y.
5. All other components are 0603 size.
6. Replace R6 with 0 Ω resistor if 75 Ω connector is used.
SCLK
Rev A10 010516
2-7
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