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HFBR-5527 Datasheet PDF : 12 Pages
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HFBR-5527 Transmitter
Electrical/Optical Characteristics 0 to 70°C, unless otherwise stated.
Parameter
Symbol Min. Typ.[2] Max. Unit
Condition
Note
Transmitter Output Optical
Power, 1 mm POF
PT
-9.5 -7.0 -4.8 dBm IF,dc = 30 mA, 25°C Note 3
-10.4
-4.3
0-70°C
Transmitter Output Optical
PT
Power, 200 µm HCS®
-13.0 -10.5 dBm IF,dc = 60 mA, 25°C Note 3
-10.0
0-70°C
Output Optical Power
∆PT
Temperature Coefficient
∆T
-0.02
dB/°C
Peak Emission Wavelength
Peak Wavelength
Temperature Coefficient
λPK
640 650 660
nm
∆λ
0.12
nm/ °C
∆T
Spectral Width
FWHM
21
nm
Full Width,
Half Maximum
Forward Voltage
Forward Voltage
Temperature Coefficient
VF
1.8 2.0 2.4
V
∆VF
-1.8
mV/°C
∆T
IF = 60 mA
Transmitter Numerical
NA
0.5
Aperture
Thermal Resistance,
θjc
Junction to Case
140
°C/W
Note 4
Reverse Input Breakdown
Voltage
VBR
3.0 13
V
IF,dc = -10 µA
Diode Capacitance
CO
60
pF
VF = 0 V,
f = 1 MHz
Unpeaked Optical Rise
tr
Time, 10% - 90%
12
ns
IF = 60 mA
Figure 5
f = 100 kHz Note 5
Unpeaked Optical Fall
tf
Time, 90% - 10%
9
ns
IF = 60 mA
Figure 5
f = 100 kHz Note 5
Notes:
1. 1.6 mm below seating plane.
2. Typical data is at 25°C.
3. Optical Power measured at the end of 0.5 meter of 1 mm diameter plastic or 200 µm diameter hard clad silica optical fiber with a large
area detector.
4. Typical value measured from junction to PC board solder joint.
5. Optical rise and fall times can be reduced with the appropriate driver circuit.
6. Pins 9 and 10 are primarily for mounting and retaining purposes, but are electrically connected with conductive housing; pins 5 and 6
are electrically unconnected. It is recommended that pins 5, 6, 9, and 10 all be connected to Rx ground to reduce coupling of
electrical noise.
7. Refer to the Versatile Link Family Fiber Optic Cable and Connectors Technical Data Sheet for cable connector options for 1 mm
plastic optical fiber and 200 µm HCS fiber.
8. The LED current peaking necessary for high frequency circuit design contributes to electromagnetic interference (EMI). Care must be
taken in circuit board layout to minimize emissions for compliance with governmental EMI emissions regulations.
171
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