REFERENCE
C1, C4
C3, CH
C5, C6
C8, C9
C10, C19
C11
C15
C16
C17
CF
CT
D1, D2, D3, D4, D10
D5
D6, D8, D9
D11, D12, D13
F1
IC1
L1
Q1
Q2
Q3
DESCRIPTION
1µF, 630V Film (250VAC)
6.8nF, 1KV Ceramic disk
680µF, 200V Electrolytic
0.1µF, 50V Ceramic
1µF, 50V Ceramic
0.001µF, 50V Ceramic
330µF, 25V Electrolytic
100µF, 25V Electrolytic
10µF, 25V Electrolytic
0.47µF, 50V Ceramic
0.002µF, 50V Ceramic
1N5406 (Motorola)
MUR850 (Motorola)
1N4148
5A, 250V 3AG with clips
ML4812CP (Micro Linear)
2mH, 4A IPEAK (see note)
IRF840 or MTPN8N50
LM7815CT
2N2222 or equivalent
ML4812
REFERENCE
R1A, R1B, R4A, R4B
R2A, R5A
R2B, R5B
R3, R13
R6, R7, RPB
R10
R11
R12
RG
RM
RPA, R15
RS
RSC
RT
T1
DESCRIPTION
180kΩ
10kΩ TRIMPOT BOURNS
3299 or equivalent
3.9kΩ
22kΩ
150kΩ
39kΩ, 2W
33kΩ
1kΩ
10Ω
27kΩ
360kΩ
100kΩ
33kΩ
7.5kΩ
SPANG F41206-TC
NS = 80, NP = 1 (see note)
Notes:
All resistors 1/4W unless otherwise specified. Some reference designators
are skipped (e.g. C2, C12, etc.) and do not appear on the schematic.
These designators were used in previous revisions of the board and are
not used on this revision. Additional information on key components is
included in the attached appendix.
Table 2. Component Values/Bill of Materials for Figure 12
REV. 1.0 10/10/2000
13