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SPT9712 Ver la hoja de datos (PDF) - Signal Processing Technologies

Número de pieza
componentes Descripción
Fabricante
SPT9712
SPT
Signal Processing Technologies SPT
SPT9712 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
PIN ASSIGNMENTS
D6 5
D7 6
D8 7
D9 8
D10 9
D11 10
(LSB) D12 11
PLCC
25 Analog VEE
24 RSet
23 N/C
22 Ref GND
21 Digital VEE
20 Ref Out
19 Control Amp In
PIN FUNCTIONS
Name
Function
Out+
Analog Current Output
Out–
Complementary Analog Current Output
D1–D12
Digital Input Bits (D12 is the LSB)
Latch Enable Latch Control Line
Ref In
Voltage Reference Input
Ref Out
Internal Voltage Reference Output
Normally Connected to Control Amp In
Ref GND
Ground Return For Internal Voltage
Reference and Amplifier
Control Amp In Normally Connected to Ref Out If Not
Connected to External Reference
Control Amp Out Output of Internal Control Amplifier
Normally Connected to Ref In
RSet1
Connection for External Resistance
Reference When Using Internal Amplifier
Nominally 7.5 k
Analog Return Analog Return Ground
Analog VEE
Digital VEE
Analog Negative Supply (–5.2 V)
Digital Negative Supply (–5.2 V)
DGND
Digital Ground Return
N/C
Not Connected
1Full-Scale Current Out = 128 (Control Amp In / RSet)
ORDERING INFORMATION
PART NUMBER
SPT9712AIP
SPT9712BIP
DNL/INL
±0.75/±1.0
±1.25/±1.5
TEMPERATURE RANGE
–40 to +85 °C
–40 to +85 °C
PACKAGE
28L PLCC
28L PLCC
Signal Processing Technologies, Inc. reserves the right to change products and specifications without notice. Permission is hereby
expressly granted to copy this literature for informational purposes only. Copying this material for any other use is strictly prohibited.
WARNING – LIFE SUPPORT APPLICATIONS POLICY – SPT products should not be used within Life Support Systems without
the specific written consent of SPT. A Life Support System is a product or system intended to support or sustain life which, if it fails,
can be reasonably expected to result in significant personal injury or death.
Signal Processing Technologies believes that ultrasonic cleaning of its products may damage the wire bonding, leading to device
failure. It is therefore not recommended, and exposure of a device to such a process will void the product warranty.
SPT
7
SPT9712
2/15/01

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