TEA1098ATV Ver la hoja de datos (PDF) - Philips Electronics

Número de pieza

componentes Descripción

Fabricante

TEA1098ATV

Speech and handsfree IC

Philips Electronics 

Philips Semiconductors

Speech and handsfree IC

Product specification

TEA1098A

BONDING PAD LOCATIONS FOR TEA1098AUH

SYMBOL

HFRX

TNOI

TENV

TSEN

TNOI

RSEN

RENV

DLC

VBB

GALS

LSAO

n.c.

GND

SLPE

SLPE

LN

REG

IR

AGC

VDD

MICS

STAB

SWR

n.c.

PAD

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

COORDINATES

x

y

137.5

137.5

137.5

137.5

137.5

137.5

137.5

137.5

137.5

137.5

185.2

401.2

861.5

1125

1348.2

1537.5

1704.8

1888.8

2084

2251

2503.8

2703.8

2897

2944.8

3139.2

2944

2605.8

2375.5

2164.5

1945.2

1721.8

1494.5

1050.2

616.8

128

128

128

128

128

128

128

128

128

128.2

127

128.5

128

343

SYMBOL

SWT

IDT

TXO

GATX

TXI

GNDTX

GNDTX

MIC−

MIC+

DTMF

EARO

GARX

RECO

HFTX

HFC

PD

MUTE

BPC

EVCI

LVCI

PAD

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

COORDINATES

x

y

2944.8

2945

2945

2945

2945

2945

2945

2945

2945

2945

2940

2651

2451.8

2170.8

1934.2

1678.8

1425

1177

942.2

738.5

570

784

973.8

1182

1390

1581

1747.8

1917.2

2129

2931

3136.8

3171.2

3171.2

3171.2

3171.2

3171.2

3171.2

3171.2

3171.2

3171.2

All x/y coordinates represent the position of the centre of

the pad (in µm) with respect to the origin (x/y = 0/0) of the

die (see Fig.18). The size of all pads is 80 µm2.

2000 Aug 18

32

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