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componentes Descripción : HEAT DISSIPATORS FOR PLASTIC CASE, CASE-MOUNTED SEMICONDUCTORS
Unspecified
Unspecified
componentes Descripción : EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS
componentes Descripción : METAL CASE, CASE-MOUNTED SEMICONDUCTORS
Shenzhen Luguang Electronic Technology Co., Ltd
Shenzhen Luguang Electronic Technology Co., Ltd
componentes Descripción : Metal CASE FOR Maximum HEAT Dissipation
componentes Descripción : SEMICONDUCTORS
componentes Descripción : SEMICONDUCTORS
Número de pieza(s) : FI-G42SB-VF25
Japan Aviation Electronics Industry, Ltd.
Japan Aviation Electronics Industry, Ltd.
componentes Descripción : INSULATOR - HEAT RESISRING PLASTIC
American Microsemiconductor
American Microsemiconductor
componentes Descripción : Discrete SEMICONDUCTORS
Japan Aviation Electronics Industry, Ltd.
Japan Aviation Electronics Industry, Ltd.
componentes Descripción : INSULATOR HEAT RESISTING PLASTIC
Número de pieza(s) : 2N5832
Micro Commercial Components
Micro Commercial Components
componentes Descripción : NPN Transistor PLASTIC-CASE Bipolar
componentes Descripción : SEMICONDUCTORS Connection Diagrams
Número de pieza(s) : FU3024N IRFU3024 IRFU3024N
International Rectifier
International Rectifier
componentes Descripción : Discrete SEMICONDUCTORS IRFU3024 / TO252
Unspecified
Unspecified
componentes Descripción : PLASTIC-CASE JUNCTION FIELD-EFFECT TRANSISTORS
Número de pieza(s) : SP24
Unspecified
Unspecified
componentes Descripción : HEAT Shrink
First Components International
First Components International
componentes Descripción : 35 Amps PLASTIC CASE Silicon Bridge Rectifiers
First Components International
First Components International
componentes Descripción : 40 Amps PLASTIC CASE Silicon Bridge Rectifiers
componentes Descripción : Single and Dual Output – DIP14 - PLASTIC CASE
Número de pieza(s) : TAT-125-3 TAT-125-3/16-0-STK
TE Connectivity
TE Connectivity
componentes Descripción : HEAT Shrink Tubing
NEC => Renesas Technology
NEC => Renesas Technology
componentes Descripción : HIGH HEAT RESISTIVITY
componentes Descripción : HIGH HEAT RESISTIVITY
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