Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits
English
한국어
日本語
русский
简体中文
español
Número de pieza
componentes Descripción
A9211B Ver la hoja de datos (PDF) - AMIC Technology
Número de pieza
componentes Descripción
Fabricante
A9211B
ISO/IEC 14443A RFID TAG IC
AMIC Technology
A9211B Datasheet PDF : 15 Pages
First
Prev
11
12
13
14
15
A9211B
ISO/IEC 14443A RFID TAG IC
11. Gold Bump Specification
․
Bump material:
>99.9% pure Au
․
Bump hardness:
35 – 80 HV 0.005
․
Bump shear strength:
>70MPa
․
Bump height:
18
u
m
․
Bump height uniformly:
–
Within a die
±
2
u
m
–
Within a wafer
±
3
u
m
–
Wafer to wafer
±
4
u
m
․
Bump flatness:
±
1.5
u
m
․
Bump size:
–
ANTP, ANTM:
80um x 80um;
–
TIO0 TIO1, TIO2:
50um x 50um
–
Variation:
±
5
u
m
․
Under bump metallization:
Sputtered TiW
p
11 of 15
Ver. 1.0
Share Link:
datasheetq.com [
Privacy Policy
]
[
Request Datasheet
] [
Contact Us
]