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Número de pieza
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OR3C55-4S208 Ver la hoja de datos (PDF) - Agere -> LSI Corporation
Número de pieza
componentes Descripción
Fabricante
OR3C55-4S208
ORCA® Series 3C and 3T Field-Programmable Gate Arrays
Agere -> LSI Corporation
OR3C55-4S208 Datasheet PDF : 210 Pages
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ORCA
Series 3C and 3T FPGAs
Package Outline Diagrams
(continued)
256-Pin PBGA
Dimensions are in millimeters.
A1 BALL
IDENTIFIER ZONE
27.00
±
0.20
+0.70
24.00
–0.00
Data Sheet
June 1999
+0.70
24.00
–0.00
27.00
±
0.20
MOLD
COMPOUND
PWB
0.36
±
0.04
1.17
±
0.05
0.60
±
0.10
SOLDER BALL
19 SPACES @ 1.27 = 24.13
2.13
±
0.19
SEATING PLANE
0.20
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
CENTER ARRAY
FOR THERMAL
ENHANCEMENT
(OPTIONAL)
E
D
C
(SEE NOTE BELOW)
B
A
A1 BALL
CORNER
1 2 3 4 5 6 7 8 9 10 12 14 16 18 20
11 13 15 17 19
0.75
±
0.15
19 SPACES
@ 1.27 = 24.13
Note: Although the 16 thermal enhancement balls are stated as an option, they are standard on the 256 FPGA package.
5-4406(F)
202
Lucent Technologies Inc.
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