NDF04N60Z, NDD04N60Z
TYPICAL CHARACTERISTICS
10
50% (DUTY CYCLE)
1.0 20%
10%
5.0%
2.0%
0.1
1.0%
SINGLE PULSE
0.01
0.000001 0.00001
0.0001
0.001
0.01
0.1
1.0
PULSE TIME (s)
Figure 13. Thermal Impedance for NDF04N60Z
10
50% (DUTY CYCLE)
1.0
20%
10%
0.1 5.0%
2.0%
1.0%
0.01 SINGLE PULSE
0.001
0.000001 0.00001
0.0001
0.001
0.01
0.1
1.0
PULSE TIME (s)
Figure 14. Thermal Impedance for NDD04N60Z
RqJC = 4.2°C/W
Steady State
10
100
1000
RqJC = 1.5°C/W
Steady State
10
100
1000
LEADS
HEATSINK
0.110″ MIN
Figure 15. Mounting Position for Isolation Test
Measurement made between leads and heatsink with all leads shorted together.
*For additional mounting information, please download the ON Semiconductor
Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5