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Número de pieza
componentes Descripción
CXK5B16120TM-12 Ver la hoja de datos (PDF) - Sony Semiconductor
Número de pieza
componentes Descripción
Fabricante
CXK5B16120TM-12
65536-word × 16-bit High Speed Bi-CMOS Static RAM
Sony Semiconductor
CXK5B16120TM-12 Datasheet PDF : 10 Pages
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Package Outline
Unit: mm
CXK5B16120J
44
44PIN SOJ (PLASTIC) 400mil
+ 0.4
28.58 – 0.1
23
R0.254
1
+ 0.08
0.73 – 0.07
22
1.27
+ 0.075
0.43 – 0.045
0.178 M
1.15 MAX
+ 0.2
2.2 – 0.11
0.1
CXK5B16120J/TM
SONY CODE
EIAJ CODE
JEDEC CODE
SOJ-44P-01
∗
SOJ044-P-0400-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
1.9g
CXK5B16120TM
44PIN TSOP (
II
) (PLASTIC) 400mil
∗
18.41 ± 0.1
44
23
1.2 MAX
0.1
A
1
0.8
B
22
0.3 ± 0.1
0.13 M
+ 0.05
0.125
– 0.02
+ 0.1
0.1 – 0.05
0.32 ± 0.08
(0.3)
DETAIL
B
0° to 10°
DETAIL
A
NOTE: Dimension “
∗
†does not include mold protrusion.
SONY CODE
EIAJ CODE
JEDEC CODE
TSOP (
II
) -44P-L01
TSOP (
II
) 044-P-0400-A
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY / PHENOL RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
42 ALLOY
PACKAGE WEIGHT
0.5g
– 10 –
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