FOD2200SV Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
FOD2200SV Datasheet PDF : 11 Pages
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Package Dimensions
Through Hole
4
3
5
6
21
7
8
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
0.200 (5.08)
0.140 (3.55)
0.022 (0.56)
0.016 (0.41)
0.390 (9.91)
0.370 (9.40)
0.070 (1.78)
0.045 (1.14)
0.020 (0.51) MIN
0.154 (3.90)
0.120 (3.05)
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
15° MAX
0.300 (7.62)
TYP
Surface Mount
0.390 (9.91)
0.370 (9.40)
4
3
2
1
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
5
6
7
8
0.070 (1.78)
0.045 (1.14)
0.300 (7.62)
TYP
0.020 (0.51)
MIN
0.016 (0.41)
0.008 (0.20)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
0.045 (1.14)
0.315 (8.00)
MIN
0.405 (10.30)
MAX.
Note:
All dimensions are in inches (millimeters)
0.4" Lead Spacing
4
3
21
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
5
6
7
8
0.200 (5.08)
0.140 (3.55)
0.022 (0.56)
0.016 (0.41)
0.390 (9.91)
0.370 (9.40)
0.070 (1.78)
0.045 (1.14)
0.004 (0.10) MIN
0.154 (3.90)
0.120 (3.05)
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.400 (10.16)
TYP
8-Pin DIP – Land Pattern
0.070 (1.78)
0.060 (1.52)
0.295 (7.49)
0.415 (10.54)
0.100 (2.54)
0.030 (0.76)
©2004 Fairchild Semiconductor Corporation
FOD2200 Rev. 1.0.1
8
www.fairchildsemi.com
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